Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11996384
SERIAL NO

17122796

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Abstract

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An apparatus for debonding a wafer from a bonded wafer stack is disclosed. The apparatus includes a flashlamp, a flashlamp control unit, and a wafer debonding unit. A processed wafer can be debonded from a bonded wafer stack by applying light pulses from the flashlamp. The flashlamp is controlled by the flashlamp control unit that includes a capacitor bank, a power supply for charging the capacitor bank, an IGBT-based switching device, and a frequency controller. The wafer debonding unit includes a debonding vacuum table, a wafer feeding robot for conveying the bonded wafer stack to the debonding vacuum table, a set of suction cups for applying vacuum to the bonded wafer stack when light pulses are being emitted by the flashlamp to debond the processed wafer from the bonded wafer stack.

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Patent Owner(s)

Patent OwnerAddress
PULSEFORGE INC400 PARKER DRIVE SUITE 1100 AUSTIN TX 78728

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Attar, Vahid Akhavan Austin, US 10 2
Turkani, Vikram S Austin, US 4 0

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