Method for polishing semiconductor substrate

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United States of America Patent

PATENT NO 11999027
APP PUB NO 20220384198A1
SERIAL NO

17818135

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Abstract

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A method for polishing a semiconductor substrate includes the following operations. A semiconductor substrate is received. An abrasive slurry having a first temperature is dispensed to a polishing surface of a polishing pad. The semiconductor substrate is polished. The abrasive slurry have a second temperature is dispensed to the polishing surface of the polishing pad during the polishing of the semiconductor substrate. The second temperature is different from the first temperature.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwang, James Jeng-Jyi Hsin-Chu County, TW 14 34
Peng, He Hui Changhua County, TW 16 38
Wu, Jiann Lih Hsin-Chu, TW 13 43
Yang, Chi-Ming Hsinchu, TW 184 1930

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