Acoustic device thermoforming

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12000140
SERIAL NO

17074090

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Abstract

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A method of fabricating an acoustic device includes forming a plurality of holes in a panel, disposing the panel in a support frame, and heating the panel to a temperature such that the panel sags while disposed in the support frame and each hole of the plurality of holes is modified.

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Patent Owner(s)

Patent OwnerAddress
THE REGENTS OF THE UNIVERSITY OF MICHIGANOFFICE OF TECHNOLOGY TRANSFER 1600 HURON PARKWAY 2ND FLOOR ANN ARBOR MI 48109

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Belanger, Zackery Detroit, US 1 3
McGee, Jonathan Wesley Ann Arbor, US 6 19
Newell, Cathlyn Detroit, US 2 3

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