Method for producing resin mold-type electronic component and resin mold-type electronic component

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United States of America

PATENT NO 12002622
SERIAL NO

17371668

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Abstract

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A method for producing a resin mold-type electronic component in which an electronic component main body is covered with a mold resin includes preparing a first mold resin provided with a metal terminal, having an accommodating portion for the electronic component main body, and having a joining material filling space to be filled with a joining material, accommodating the electronic component main body in the accommodating portion of the first mold resin, and joining the metal terminal and a terminal electrode of the electronic component main body by filling the joining material filling space with the joining material.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATIONTOKYO 103-6128

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yazawa, Kosuke Tokyo, JP 34 86

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