Articles including metallized vias

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12004295
APP PUB NO 20210092843A1
SERIAL NO

17111144

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
CORNING INCORPORATEDSP-TI-3-1 CORNING NY 14831

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jayaraman, Shrisudersan Horseheads, US 25 138

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