Composition, kit, and method for treating substrate

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United States of America

PATENT NO 12012658
SERIAL NO

17565419

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Abstract

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An object of the present invention is to provide a composition that exhibits excellent dissolving ability and etching selectivity (particularly, etching selectivity for a Ru-containing substance and other metal-containing substances) to metal-containing substances (particularly, a Ru-containing substance), a kit for preparing the composition, and a method for treating a substrate by using the composition.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATION26-30 NISHIAZABU 2-CHOME MINATO-KU TOKYO 106-8620

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kamimura, Tetsuya Shizuoka, JP 159 522
Mizutani, Atsushi Shizuoka, JP 129 834

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