Device and method for providing a thermally conductive coupling

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United States of America Patent

PATENT NO 12013170
APP PUB NO 20230175756A1
SERIAL NO

17998627

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Abstract

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A device intended for cooling an object being moved within a cryostat comprises a heat transfer section forming a contact surface for said object and means for fastening the heat transfer section to a cooling structure in such a way that said contact surface remains free. The device comprises a spring section which is separate from said heat transfer section and which is arranged to exert on the heat transfer section a spring force pushing said contact surface in a direction in which it is intended to contact said object.

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Patent Owner(s)

Patent OwnerAddress
BLUEFORS OYHELSINKI

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blaauwgeers, Rob Helsinki, FI 4 4
Salmela, Anssi Helsinki, FI 3 0
Vorselman, Pieter Helsinki, FI 4 0

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