Electrochemical mechanical polishing and planarization equipment for processing conductive wafer substrate

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United States of America Patent

PATENT NO 12017293
APP PUB NO 20240149361A1
SERIAL NO

18156396

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Abstract

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The invention discloses an electrochemical mechanical polishing/planarization equipment for processing a polishing surface of a conductive wafer substrate, which includes a power supply; a polishing table with conductivity; a polishing pad including an insulating active layer and having holes where a conductive chemical liquid is accommodated; a polishing head having conductivity and being attached to the back of the polishing surface. The power supply, the polishing table, the chemical liquid, the conductive wafer substrate, and the polishing head in sequence form a conductive loop, and an electrochemical reaction layer is formed on the polishing surface of the conductive wafer substrate. The polishing head drives the wafer substrate to move relative to the polishing pad, and to implement a mechanical polishing or a chemical mechanical polishing of the electrochemical reaction layer.

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Patent Owner(s)

Patent OwnerAddress
HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC1ST FLOOR BUILDING 1 NO 88 CHUANGYE STREET QINGSHANHU LINAN HANGZHOU ZHEJIANG 311305

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Deng, Yaomin Zhejiang, CN 3 0
Wang, Donghui Zhejiang, CN 70 317
Zhu, Zhengting Zhejiang, CN 2 0

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