Printed circuit board and method for manufacturing the same

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United States of America Patent

PATENT NO 12022621
APP PUB NO 20230337367A1
SERIAL NO

17869035

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Abstract

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A method of manufacturing a printed circuit board includes: forming first and second resist films, respectively having first and second openings exposing a first metal layer disposed on one surface of an insulating layer; forming a second metal layer on the first metal layer, exposed through the first and second openings, to fill at least a portion of each of the first and second openings; and removing the first and second resist films. The first and second openings have different widths in a cross-section.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU GYEONGGI-DO SUWON-SI 16674

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chung, In Jae Suwon-si, KR 53 850
Jeon, Mi Jeong Suwon-si, KR 6 2
Yang, Hyun Seok Suwon-si, KR 18 46
Yoo, Tae Hee Suwon-si, KR 14 2930

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