High dynamic temperature control system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12030224
APP PUB NO 20220266478A1
SERIAL NO

17682622

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A molding system is provided, which includes at least one mold part and a heating and cooling module. The at least one mold part defines a mold cavity having an opening. The heating and cooling module is inserted into the opening to close the mold cavity. The heating and cooling module includes a die insert defining a mold surface, a layered heater for heating the mold surface, and a cooling unit for cooling the mold surface. The layered heater is disposed between the die insert and the cooling unit and includes functional layers formed directly on a surface of the cooling unit or a surface of the die insert opposite to the mold surface by using layered or layering processes selected from a group consisting of thick film, thin film, thermal spray and sol-gel processes.

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Patent Owner(s)

Patent OwnerAddress
WATLOW ELECTRIC MANUFACTURING COMPANY12001 LACKLAND ROAD ST LOUIS MO 63146

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Antosch, Gernot Hallein, AT 11 42
Burr, August Bretzfeld, DE 5 25
Kübler, Michael Untergruppenbach-Oberheinriet, DE 4 9
Lehnert, Reinhardt Ubstadt-Weiher, DE 5 30
Pöschl, Wolfgang Abtenau, AT 5 15
Schefbänker, Gerhard Scheffau am Tennengebirge, AT 4 15
Wallinger, Martin Abtenau, AT 22 53

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