Circuit structure

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United States of America Patent

PATENT NO 12035467
APP PUB NO 20230354515A1
SERIAL NO

18341796

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Abstract

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A circuit structure that comprises a substrate and one or more conductive elements disposed on the substrate is provided. The substrate comprises a polymer composition that comprises an electrically conductive filler distributed within a polymer matrix. The polymer matrix contains at least one thermoplastic high performance polymer having a deflection under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa, and the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.

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Patent Owner(s)

Patent OwnerAddress
TICONA LLCFLORENCE KY 41042

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Young Shin Cincinnati, US 167 1399

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