Method for laser cutting polycrystalline diamond structures

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United States of America Patent

PATENT NO 12042906
APP PUB NO 20210162566A1
SERIAL NO

17172682

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Abstract

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Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

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Patent Owner(s)

Patent OwnerAddress
US SYNTHETIC CORPORATIONOREM UT 84058

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chapman, Mark P Provo, US 18 204
Christensen, Nicholas Spanish Fork, US 9 149
Crockett, Damon B Mapleton, US 15 265
Ward, Ronald W Pleasant Grove, US 11 169

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