Thermally conductive compositions for targeted heat dissipation of electronic components

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United States of America Patent

PATENT NO 12048121
APP PUB NO 20230057644A1
SERIAL NO

17404766

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Thermal spreaders for targeted heat dissipation of an electronic component are disclosed. One thermal spreader includes a thermally conductive composition configured to function in conjunction with an electrically insulator material to dissipate heat away from a heat-generating electronic component of a computing device while electrically insulating the electronic component. The thermally conductive composition is malleable to target placement of the thermally conductive material on the electrically insulator material such that the thermally conductive composition is in thermal communication with a targeted area of the electronic component over which the electrically insulator material is positioned for targeted heat dissipation of the electronic component. Apparatus and systems including one or more of the thermal spreaders for targeted heat dissipation of one or more electronic components included therein are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
LENOVO SWITZERLAND INTERNATIONAL GMBHC/O BRIGHT LAW AG BUNDESPLATZ 9 ZUG 6300

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jakes, Philip J Durham, US 27 283
Wong, Tin-Lup Chapel Hill, US 126 736
Yebka, Bouziane Apex, US 56 52

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