Electroforming method and method for producing electroforming material

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United States of America Patent

PATENT NO 12049705
APP PUB NO 20230101613A1
SERIAL NO

17930719

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Abstract

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An electroforming method capable of suppressing peeling of an electroforming material from an electroforming master during electroforming, and controlling a shape of an electroforming material, and a method for producing an electroforming material are provided. The present invention is to provide the electroforming method including forming an electroforming material on a surface of an electroforming master in an electroforming liquid by using the electroforming master as a cathode, in which the electroforming master includes a conductive substrate having a pattern on a surface, the pattern having a protruding portion of which a surface is non-conductive, and an underlying layer that has a sheet resistance of 500 Ω/sq or greater, and that is formed on at least a part of the surface of the substrate in an in-plane direction, and the method for producing an electroforming material.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATIONTOKYO 106-8620

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Umezawa, Tomokazu Kanagawa, JP 15 25

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