Microelectronic assembly from processed substrate
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United States of America Patent
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Jul 30, 2024
Grant Date -
Sep 8, 2022
app pub date -
May 26, 2022
filing date -
Dec 28, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Representative implementations of techniques, methods, and formulary provide repairs to processed semiconductor substrates, and associated devices, due to erosion or “dishing” of a surface of the substrates. The substrate surface is etched until a preselected portion of one or more embedded interconnect devices protrudes above the surface of the substrate. The interconnect devices are wet etched with a selective etchant, according to a formulary, for a preselected period of time or until the interconnect devices have a preselected height relative to the surface of the substrate. The formulary includes one or more oxidizing agents, one or more organic acids, and glycerol, where the one or more oxidizing agents and the one or more organic acids are each less than 2% of formulary and the glycerol is less than 10% of the formulary.
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