Substrate processing apparatus and substrate processing method

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United States of America Patent

PATENT NO 12057327
APP PUB NO 20230187233A1
SERIAL NO

18107935

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Abstract

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There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO 107-6325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Biwa, Satoshi Koshi, JP 12 29
Douki, Yuichi Koshi, JP 27 187
Gosho, Masataka Koshi, JP 8 1
Kunugimoto, Yuichiro Koshi, JP 14 12
Okamura, Satoshi Koshi, JP 39 271
Ookawa, Katsuhiro Koshi, JP 10 24

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