Hydrophilization treatment liquid for semiconductor wafer surface

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United States of America Patent

PATENT NO 12060498
APP PUB NO 20210343542A1
SERIAL NO

17261931

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a hydrophilization treatment liquid for a semiconductor wafer surface, the hydrophilization treatment liquid being capable of imparting hydrophilicity to the semiconductor wafer surface.

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Patent Owner(s)

Patent OwnerAddress
DAICEL CORPORATIONOSAKA 530-0011

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sakanishi, Yuichi Tokyo, JP 36 95

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