Packaging design for a flow sensor and methods of manufacturing thereof

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United States of America Patent

PATENT NO 12061103
APP PUB NO 20220357187A1
SERIAL NO

17316622

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Abstract

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Disclosed herein are embodiments of a sensor assembly, methods of manufacturing the same, and methods of using the same. In one embodiment, a sensor assembly comprises a substrate comprising an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further comprising electrical contact pads on at least the inner region. The sensor assembly further comprises a housing coupled to the substrate at the outer region or at the middle region to form a hermetic seal. The sensor assembly further comprises a sensor device coupled to the substrate, via the electrical contact pads, at the inner region. In certain embodiments, the sensor assembly further comprises a conformal coating deposited on at least a portion of the sensor assembly.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gunturi, Ramachandra Murthy Bangalore, IN 4 4
Krishnamurthy, Srikanth Bangalore, IN 14 469
Okada, Ashley M San Jose, US 19 38
Parkhe, Vijay San Jose, US 26 1750
Xu, Ming San Jose, US 491 9425

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