Advanced temperature monitoring system and methods for semiconductor manufacture productivity
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United States of America Patent
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Aug 20, 2024
Grant Date -
Jul 18, 2019
app pub date -
Jan 14, 2019
filing date -
Jan 14, 2019
priority date (Note) -
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Abstract
Embodiments herein provide methods of monitoring temperatures of fluid delivery conduits for delivering fluids to, and other components external to, a processing volume of a processing chamber used in electronic device fabrication manufacturing, and monitoring systems related thereto. In one embodiment, a method of monitoring a processing system includes receiving, through a data acquisition device, temperature information from one or more temperature sensors and receiving context information from a system controller coupled to a processing system comprising the processing chamber. Here, the one or more temperature sensors are disposed in one or more locations external to a processing volume of a processing chamber. The context information relates to instructions executed by the system controller to control one or more operations of the processing system.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- APPLIED MATERIALS INC.
International Classification(s)

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- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Johnson, Michael W | Austin, US | 121 | 5040 |
Lu, Xuesong | Santa Clara, US | 22 | 57 |
Oh, Jang Seok | San Ramon, US | 10 | 41 |
Pasupathy, Balaji | Chennai, IN | 2 | 4 |
Werner, Joseph C | Santa Clara, US | 11 | 183 |
Zhang, Lin | San Jose, US | 453 | 3838 |
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