Moisture resistance improver for water-based adhesive for inorganic materials, and water-based adhesive for inorganic materials

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United States of America

PATENT NO 12071567
SERIAL NO

17261973

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Abstract

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Provided are a moisture resistance improver that yields a water-based adhesive for inorganic materials having exceptional adhesiveness of inorganic materials, and a water-based adhesive for inorganic materials in which the moisture resistance improver is used. The present invention is a moisture resistance improver (J) for a water-based adhesive for inorganic materials containing at least one (co)polymer (A) selected from the group consisting of (co)polymer (A1) and (co)polymer (A2). (Co)polymer (A1): a (co)polymer having a weight-average molecular weight of 3,000-150,000, and containing, as structural monomers, a C3-30 unsaturated (poly)carboxylic acid (anhydride) (a1) and a (meth)acrylic acid ester (a2) having solubility of 10 g or less per 100 g of water at 25° C. (Co)polymer (A2): a (co)polymer having a weight-average molecular weight of 6,000-150,000, and containing the above unsaturated (poly)carboxylic acid (anhydride) (a1) as a structural monomer but not containing the above (meth)acrylic acid ester (a2) as a structural monomer.

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Patent Owner(s)

Patent OwnerAddress
SANYO CHEMICAL INDUSTRIES LTDKYOTO-SHI KYOTO 605-0995

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hayashi, Miyuki Kyoto, JP 51 3
Kita, Ai Kyoto, JP 4 0

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