Surface treatment method for copper or copper alloy, surface treatment liquid for sterilizing copper or copper alloy, and sterilization method using copper or copper alloy treated by said method

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United States of America Patent

PATENT NO 12071693
APP PUB NO 20230084143A1
SERIAL NO

17990028

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL INSTITUTE FOR MATERIALS SCIENCE2-1 SENGEN 1-CHOME TSUKUBA-SHI IBARAKI 3050047 ?3050047

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Oishi, Keiichiro Tokyo, JP 78 383
Tanaka, Shinji Tokyo, JP 329 3474
Yamamoto, Akiko Ibaraki, JP 22 193

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