Semiconductor manufacturing equipment and semiconductor manufacturing method

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United States of America Patent

PATENT NO 12074072
APP PUB NO 20210242095A1
SERIAL NO

17235053

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Semiconductor manufacturing equipment includes a thickness calculation function, the thickness calculation function including a measurement value acquisition unit configured to acquire a plurality of measurement values at different measurement positions of the wafer from a thickness measurement function configured to measure a thickness of the wafer, a histogram data creation unit configured to create histogram data based on the plurality of measurement values, and a grade group extraction unit configured to extract a grade group from the histogram data, the grade group including sequential grades having frequencies equal to or greater than a predetermined frequency, the thickness calculation function further including a representative value calculation unit configured to calculate a representative value of a thickness of a measurement region based on the grades included in the extracted grade group.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATIONTOKYO 100-8310

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tanaka, Hiroshi Tokyo, JP 1068 12184

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