Method and system for processing wafer

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United States of America Patent

PATENT NO 12074074
APP PUB NO 20220392811A1
SERIAL NO

17340114

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Abstract

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The present disclosure provides a method and a system therefore for processing wafer. The method includes: monitoring a distribution of particles in a chamber while processing the wafer; determining at least one parameter according to the distribution of the particles for configuring at least one device of the chamber; configuring the at least one device of the chamber according to the at least one parameter; and processing another wafer based on a recipe after configuring the at least one device of the chamber.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chao, Cha-Hsin Taipei, TW 33 176
Chen, Po-Ju Hsinchu, TW 34 123
Cheng, Sheng-Jen Tainan, TW 1 0
Liao, Chih-Teng Hsinchu, TW 87 366

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