Method for manufacturing cured film, method for manufacturing electronic component, and electronic component

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United States of America

PATENT NO 12077677
SERIAL NO

17548454

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Abstract

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Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film.

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Patent Owner(s)

Patent OwnerAddress
SEKISUI CHEMICAL CO LTDOSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujita, Yoshito Osaka, JP 9 29
Inoue, Takanori Osaka, JP 64 341
Inui, Osamu Osaka, JP 17 143
Maenaka, Hiroshi Osaka, JP 12 74
Nakamura, Shigeru Shiga, JP 250 2643
Takahashi, Ryosuke Osaka, JP 114 214
Tanikawa, Mitsuru Osaka, JP 21 133
Ueda, Michihisa Osaka, JP 16 75
Watanabe, Takashi Osaka, JP 841 9190

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