CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same

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United States of America Patent

PATENT NO 12077681
APP PUB NO 20220298382A1
SERIAL NO

17695022

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Abstract

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A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the composition comprising a solvent; an abrasive agent; and a dendritic poly(amidoamine) containing a terminal functional group that has a pKa of about 6 or less.

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Patent Owner(s)

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SAMSUNG SDI CO LTDYONGIN-SI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Chang Suk Suwon-si, KR 12 9
Lee, Hyun Woo Suwon-si, KR 557 7890
Lee, Ji Ho Suwon-si, KR 25 130
Lee, Jong Won Suwon-si, KR 190 1526
Lee, Young Gi Suwon-si, KR 42 314
Sim, Soo Yeon Suwon-si, KR 5 0

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