Method for manufacturing conductive paste and method for manufacturing multilayer ceramic electronic component

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United States of America Patent

PATENT NO 12087464
APP PUB NO 20230253131A1
SERIAL NO

17721839

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Abstract

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A method for manufacturing a conductive paste includes preparing a first solution including a metal particle and a first solvent, preparing a second solvent, preparing a surfactant including a core particle and an organic material disposed on a surface of the core particle, and mixing the first solution, the second solvent, and the surfactant to form a mixed solution.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU SUWON-SI GYEONGGI-DO 16674 16674

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kwon, Tae Gyun Suwon-si, KR 20 18
Lee, Eung Seok Suwon-si, KR 12 22

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