Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

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United States of America Patent

PATENT NO 12098257
APP PUB NO 20220259424A1
SERIAL NO

17626881

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Abstract

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An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent.

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Patent Owner(s)

Patent OwnerAddress
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTDOSAKA-SHI OSAKA 540-6207

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Hiroharu Osaka, JP 56 189
Saito, Hirosuke Osaka, JP 27 59
Wang, Yiqun Osaka, JP 30 806

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