Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powder

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United States of America Patent

PATENT NO 12098290
APP PUB NO 20210371666A1
SERIAL NO

17321827

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Abstract

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The present invention is a low dielectric silica powder, which has an average particle size of 0.1 to 30 μm and a dielectric loss tangent of 0.0005 or less at 10 GHz. An object is to provide: a silica powder with an extremely small dielectric loss tangent; a resin composition containing the same; and a method for manufacturing a silica powder with a low dielectric loss tangent and strong adhesion at the interface to resin.

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Patent Owner(s)

Patent OwnerAddress
SHIN-ETSU CHEMICAL CO LTDTOKYO 1000005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Itokawa, Hajime Annaka, JP 6 2
Shiobara, Toshio Annaka, JP 233 2183

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