Circuit board using thermocouple to dissipate generated heat and method for manufacturing the same

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United States of America Patent

PATENT NO 12101871
APP PUB NO 20230389170A1
SERIAL NO

17844170

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Abstract

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A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.

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Patent Owner(s)

Patent OwnerAddress
AVARY HOLDING (SHENZHEN) CO LIMITED27TH FLOOR BLOCK A AVARY TIME CENTER NO 2038 HAIXIU ROAD HAIBIN COMMUNITY XIN AN STREET SHENZHEN
GARUDA TECHNOLOGY CO LTD8F NO 8 BAOQIANG ROAD BAOXINGLI XINDIAN DISTRICT NEW TAIPEI CITY 231610
QING DING PRECISION ELECTRONICS (HUAIAN) CO LTDNO 8 PENGDING ROAD HUAI AN CITY JIANGSU PROVINCE CHINA HUAI AN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
He, Huan-Yu Shenzhen, CN 1 0
Huang, Mei-Hua Shenzhen, CN 14 15
Li, Biao Shenzhen, CN 87 320
Wu, Jin-Cheng Huai an, CN 5 0

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