Circuit board and manufacturing method therefor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12101891
APP PUB NO 20230007782A1
SERIAL NO

17780963

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Abstract

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A manufacturing method of a circuit board includes: providing a first double-sided copper laminate including a dielectric layer, a first copper foil layer and a copper plating layer, wherein the dielectric layer, wherein the dielectric layer defines a groove, the copper plating layer includes a first copper plating portion in the groove and a second copper plating portion beside the first copper plating portion. A double-sided circuit substrate including base layer and two first wiring layers is provided, wherein each first wiring layer includes a signal line. Conductive paste blocks are disposed in the base layer and on both sides of the signal line; and a first double-sided copper laminate is stacked on each side of the double-sided circuit substrate, disposing the signal line in the groove. The conductive paste blocks are pressed electrically connect same to the second copper plating portions. The present disclosure further provides a circuit board.

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Patent Owner(s)

Patent OwnerAddress
AVARY HOLDING (SHENZHEN) CO LIMITED27TH FLOOR BLOCK A AVARY TIME CENTER NO 2038 HAIXIU ROAD HAIBIN COMMUNITY XIN AN STREET SHENZHEN
QING DING PRECISION ELECTRONICS (HUAIAN) CO LTDNO 8 PENGDING ROAD HUAI AN CITY JIANGSU PROVINCE CHINA HUAI AN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chih-Hung Shenzhen, CN 119 913
He, Ke Shenzhen, CN 34 45
Peng, Chao Shenzhen, CN 62 181

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