Method of bonding substrates, microchip and method of manufacturing the same

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United States of America Patent

PATENT NO 12103246
APP PUB NO 20180141280A1
SERIAL NO

15814267

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

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Patent Owner(s)

Patent OwnerAddress
USHIO DENKI KABUSHIKI KAISHATOKYO-TO 100-8150

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirose, Kenichi Tokyo, JP 52 336
Sakai, Motohiro Tokyo, JP 40 403
Suzuki, Shinji Tokyo, JP 254 2509
Takemoto, Fumitoshi Tokyo, JP 13 85

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