Bonded structure and method for producing same

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United States of America Patent

PATENT NO 12104099
APP PUB NO 20210332267A1
SERIAL NO

17369743

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Abstract

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A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.

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Patent Owner(s)

Patent OwnerAddress
DENSO CORPORATIONKARIYA-CITY AICHI 448-8661

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kondo, Koji Kariya, JP 89 1025
Miyano, Hirotaka Kariya, JP 4 1
Saito, Masami Kariya, JP 33 478

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