Etching compositions

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United States of America

PATENT NO 12104108
SERIAL NO

17102961

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Abstract

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The present disclosure is directed to etching compositions that are useful, e.g., for selectively removing tungsten (W) and/or titanium nitride (TiN) from a semiconductor substrate as an intermediate step in a multistep semiconductor manufacturing process.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM ELECTRONIC MATERIALS U S A INC80 CIRCUIT DRIVE NORTH KINGSTOWN RI 02852

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gonzalez, Frank Mesa, US 12 191
Takahashi, Tomonori Shizuoka, JP 121 1303

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