Compound, thin-film forming raw material that contains said compound, and method of manufacturing thin film

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United States of America Patent

PATENT NO 12104245
APP PUB NO 20220389570A1
SERIAL NO

17771181

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Abstract

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Provided is a thin-film forming raw material containing a compound represented by the following formula (1):

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Patent Owner(s)

Patent OwnerAddress
ADEKA CORPORATIONARAKAWA-KU TOKYO 116-8554

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Enzu, Masaki Tokyo, JP 20 19
Fukushima, Ryota Tokyo, JP 5 2
Hatase, Masako Tokyo, JP 25 15
Sakurai, Atsushi Tokyo, JP 209 1709
Takeda, Keisuke Tokyo, JP 38 195
Yamashita, Atsushi Tokyo, JP 135 3148

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