Thermal conductive silicone composition and semiconductor device

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United States of America Patent

PATENT NO 12107031
APP PUB NO 20220044983A1
SERIAL NO

17311077

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Abstract

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Provided are a thermal conductive silicone composition having a favorable heat dissipation property; and a semiconductor device using such composition. The thermal conductive silicone composition contains:

    (A) an organopolysiloxane that has a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and is represented by the following average composition formula (1)R1aSiO(4-a)/2  (1)wherein R1 represents a hydrogen atom, a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms or a hydroxy group, and a represents a number satisfying 1.8≤a≤2.2;(B) a silver powder having a tap density of not lower than 3.0 g/cm3, a specific surface area of not larger than 2.0 m2/g and an aspect ratio of 1 to 30;(C) an elemental gallium and/or gallium alloy having a melting point of 0 to 70° C. and being present at a mass ratio [Component (C)/{Component (B)+Component (C)}] of 0.001 to 0.1; and(D) a catalyst.

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Patent Owner(s)

Patent OwnerAddress
SHIN-ETSU CHEMICAL CO LTDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akiba, Shota Annaka, JP 7 18
Tsuji, Kenichi Annaka, JP 19 130
Yamada, Kunihiro Annaka, JP 111 1826

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