Ceramic-copper composite, ceramic circuit board, power module, and method of producing ceramic-copper composite

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United States of America Patent

PATENT NO 12109640
APP PUB NO 20220225498A1
SERIAL NO

17418888

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Abstract

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A ceramic-copper composite having a flat plate shape, including: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer, in which a specified Expression (1) is satisfied in a cut surface of the copper layer obtained when the ceramic-copper composite is cut at a plane perpendicular to a main surface of the ceramic-copper composite, where S(102)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (102) plane is within 10°, S(101)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (101) plane is within 10°, S(111)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (111) plane is within 10°, and S(112)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (112) plane is within 10°.

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Patent Owner(s)

Patent OwnerAddress
DENKA COMPANY LIMITEDTOKYO 103-8338

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakamura, Takahiro Omuta, JP 195 3533
Nishimura, Koji Omuta, JP 77 399
Yuasa, Akimasa Omuta, JP 11 13

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