Process for recovering heat at high temperatures in plasma reforming systems

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United States of America

PATENT NO 12110229
SERIAL NO

17276563

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Abstract

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A heat recovery system for plasma reformers is comprised of a cascade of regenerators and recuperators that are arranged to transfer in stages the heat at high temperatures for storage, transport, and recirculation. Recirculation of heat increases the efficiency of plasma reformers and heat exchanging reduces temperature of the product for downstream applications.

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Patent Owner(s)

Patent OwnerAddress
MAAT ENERGY COMPANY1558 MASSACHUSETTS AVENUE #22 CAMBRIDGE MA 02138-2931

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bromberg, Leslie Sharon, US 190 3957
Owen, Jorj Ian Dulles, US 3 0
Tran, Kim-Chinh Cambridge, US 7 113

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