Circuit board and preparation method thereof

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United States of America Patent

PATENT NO 12114424
APP PUB NO 20220322530A1
SERIAL NO

17639323

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Abstract

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A circuit board and a manufacturing method therefor. The circuit board includes a substrate and a plurality of traces arranged at intervals on the substrate. Each trace includes a seed layer located on one surface of the substrate, a first copper layer located on the surface of the seed layer away from the substrate, and a second copper layer plated on one surface of the substrate. The second copper layer covers the seed layer and the first copper layer. The ratio of the thickness of each trace to the space between any two adjacent traces is greater than 1. The thickness of the second copper layer in the thickness direction of the substrate is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate.

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Patent Owner(s)

Patent OwnerAddress
AVARY HOLDING (SHENZHEN) CO LIMITED27TH FLOOR BLOCK A AVARY TIME CENTER NO 2038 HAIXIU ROAD HAIBIN COMMUNITY XIN AN STREET SHENZHEN
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTDNO 18 TENGFEI ROAD QINHUANGDAO ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE HEBEI PROVINCE 066000

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yang, Mei Qinhuangdao, CN 70 699
Yuan, Gang Shenzhen, CN 19 29

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