Liquid immersion cooler

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12114464
APP PUB NO 20230345666A1
SERIAL NO

17725169

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Importance

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Abstract

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A liquid immersion cooler includes a metal case, a soldering layer, a heat conduction layer, and a porous structure. The metal case has a heated surface and a cooling surface disposed on back of the heated surface. The soldering layer is laid on the cooling surface. The heat conduction layer is laid on the soldering layer. The porous structure is laid on the heat conduction layer. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN MICROLOOPS CORP16F -4 NO 150 JIAN 1ST RD ZHONGHE DIST NEW TAIPEI CITY 23511

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiu, Chun-Teng New Taipei, TW 7 44

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