Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

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United States of America Patent

PATENT NO 12119131
APP PUB NO 20210366627A1
SERIAL NO

17397500

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A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTD23 SENJU-HASHIDO-CHO ADACHI-KU TOKYO 120-8555
OSAKA UNIVERSITY1-1 YAMADAOKA SUITA-SHI OSAKA 565-0871

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jiu, Jinting Tokyo, JP 12 16
Li, Wanli Osaka, JP 7 1
Suganuma, Katsuaki Osaka, JP 40 260
Ueshima, Minoru Tokyo, JP 40 315

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