Composite material and heat dissipation part
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United States of America Patent
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Oct 15, 2024
Grant Date -
Dec 8, 2022
app pub date -
Apr 8, 2022
filing date -
Jun 8, 2021
priority date (Note) -
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Abstract
A composite material and a heat dissipation part composed of the composite material are provided. More particularly, a composite material comprising a metal matrix and a structure in which thermally conductive particles are dispersed inside the metal matrix is provided, wherein: the metal matrix is composed of Cu, Ag, Al, Mg, or an alloy thereof; the thermally conductive particles include diamond or SiC; the thermally conductive particles are included at a volume ratio of 15% to 80%; in a microstructure of the composite material, the distance between the center of any one thermally conductive particle and the center of a thermally conductive particle most adjacent to the any one thermally conductive particle is 200 μm or greater; and the any one thermally conductive particle and the thermally conductive particle most adjacent thereto are not in contact with each other but have a metal matrix therebetween.
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