Chip component production method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12125618
APP PUB NO 20240153678A1
SERIAL NO

17769311

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Abstract

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A chip component 10 comprises: an insulating substrate 1 on which a resistor 3 serving as a functional element is formed; a pair of internal electrodes (front electrodes 2, end surface electrodes 6, and back electrodes 5) that is formed to cover both end portions of the insulating substrate 1 and connected to the resistor 3; a barrier layer 8 that is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layer 9 that is formed on a surface of the barrier layer 8 and mainly composed of tin, and the barrier layer 8 is composed of alloy plating (Ni—P) including nickel and phosphorus, which is formed by electrolytic plating, and a content rate of phosphorus in the alloy plating of an inner region is made different from that of an outer region so that at least the inner region of the barrier layer 8 has magnetic properties.

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Patent Owner(s)

Patent OwnerAddress
KOA CORPORATION3672 ARAI INA-SHI NAGANO 396-0025

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akahane, Yasushi Nagano, JP 7 48
Tamada, Nobuhiko Nagano, JP 3 1

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