Sensor package substrate, sensor module including the same, and electronic component embedded substrate

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United States of America Patent

PATENT NO 12125754
APP PUB NO 20220406670A1
SERIAL NO

17894584

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATION2-5-1 NIHONBASHI CHUO-KU TOKYO 103-6128

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Motohashi, Akira Tokyo, JP 11 8
Suzuki, Yoshihiro Tokyo, JP 125 1314
Tsuyutani, Kazutoshi Tokyo, JP 15 55

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