Suspended particle devices with improved adhesion between the active and conducting layers
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United States of America
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Oct 29, 2024
Grant Date -
Aug 25, 2022
app pub date -
Jul 1, 2020
filing date -
Jul 1, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A suspended-particle device with improved adhesion between the active and conductive layers is disclosed. The conductive layers are coated with an adhesion promoter that comprises at least one organosilane that covalently bonds to the surface of the conductive layer and comprises a cross-linkable moiety such as an acrylate. The active layer comprises a suspension of active particles in a polymer matrix that comprises a polymer having pendant cross-linkable moieties such as acrylates. Upon curing (e.g. by irradiation by ultraviolet light), the polymer matrix of the active layer cross-links with the cross-linkable moieties of the adhesion promoter, thereby binding the active and conductive layers.
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