Liquid resin composition for sealing and electronic component apparatus

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12131970
APP PUB NO 20200194325A1
SERIAL NO

16618697

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Abstract

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A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Hidetoshi Tokyo, JP 43 358
Kamimura, Tsuyoshi Niigata, JP 5 2
Matsuzaki, Takayuki Tokyo, JP 51 532
Takahashi, Hisato Tokyo, JP 16 157
Yoshii, Haruyuki Niigata, JP 8 41

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