Thin film capacitor and electronic circuit substrate having the same
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United States of America
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Oct 29, 2024
Grant Date -
Aug 10, 2023
app pub date -
Dec 24, 2020
filing date -
Dec 24, 2020
priority date (Note) -
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Abstract
To provide a thin film capacitor having high adhesion performance with respect to a multilayer substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. A height of the first electrode layer is lower than a height of the second electrode layer. This enhances adhesion performance when the thin film capacitor is embedded in a multilayer substrate and improves ESR characteristics.
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