Wiring substrate and method for manufacturing wiring substrate

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12144121
APP PUB NO 20230113278A1
SERIAL NO

17936924

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method for manufacturing a wiring substrate includes forming a second resin insulating layer on a first resin insulating layer such that the second resin insulating layer is in contact with a surface of the first resin insulating layer, irradiating laser upon the second resin insulating layer such that a recess penetrating through the second resin insulating layer and exposing the first resin insulating layer is formed, and forming a conductor layer including conductor material filled in the recess formed through the second resin insulating layer such that the conductor layer is embedded in the second resin insulating layer. The second resin insulating layer are formed on the surface of the first resin insulating layer such that the first resin insulating layer and the second resin insulating layer have different processability with respect to the laser.

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Patent Owner(s)

Patent OwnerAddress
IBIDEN CO LTDGIFU 503-8604

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adachi, Takema Ogaki, JP 40 177
Ikawa, Yuji Ogaki, JP 7 9

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