Radically polymerizable putty-like resin composition, sealing agent and crack repairing method

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United States of America

PATENT NO 12146009
APP PUB NO 20210214471A1
SERIAL NO

15734114

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Abstract

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The present invention relates to a radical polymerizable putty-like resin composition containing

    a resin component containing a radical reactive resin (A) and a radical polymerizable unsaturated monomer (B) having a (meth)acryloyl group in a molecule thereof,an aromatic tertiary amine (C) represented by the following general formula (I), an organic peroxide (D), anda filler (E):

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATIONTOKYO 105-7325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Niibayashi, Ryota Kumagaya, JP 10 3

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