Thermally conductive silicone gel composition

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United States of America

PATENT NO 12152147
APP PUB NO 20220169857A1
SERIAL NO

17425888

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Abstract

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A thermally conductive silicone gel composition of the present invention includes the following A to F: (A) an organopolysiloxane having two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having two Si—H groups per molecule; (C) an organohydrogenpolysiloxane having three or more Si—H groups per molecule; (D) at least one compound selected from the group consisting of D1 and D2: (D1) an organopolysiloxane having one alkenyl group per molecule and (D2) an organohydrogenpolysiloxane having one Si—H group per molecule; (E) a platinum catalyst; and (F) a thermally conductive filler in an amount of 100 to 600 vol % with respect to 100 vol % of the total amount of the A to E. The components A to F are cured. With this configuration, the thermally conductive silicone gel composition can reduce oil bleeding, even though the composition is a gel cured product.

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Patent Owner(s)

Patent OwnerAddress
FUJI POLYMER INDUSTRIES CO LTD21-11 CHIYODA 5-CHOME NAKA-KU NAGOYA-SHI AICHI 460-0012

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwai, Makoto Aichi, JP 118 504
Kataishi, Takumi Aichi, JP 10 3
Kikuchi, Setsuo Aichi, JP 4 2
Kimura, Yuko Aichi, JP 16 92
Sugie, Mai Aichi, JP 4 5

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