Method for treating substrate

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United States of America

PATENT NO 12154796
APP PUB NO 20220139731A1
SERIAL NO

17579303

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Abstract

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A method for treating a substrate, including a solvent processing step of supplying an organic solvent onto the substrate to treat the substrate, a drying step of drying the substrate to remove the organic solvent on the substrate, and a bake step of heating the substrate to thermally decompose an impurity adhering to the substrate, where the drying step and the bake step are performed in different chambers.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTD77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 31040

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Park, Joo Jib Asan-si, KR 18 98

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